Fraunhofer Institute for Applied Solid State Physics IAF
Artificial intelligence (AI) and modern Complementary Metal-Oxide-Semiconductor (CMOS) semiconductor technology are key drivers for high-performance, energy-efficient chips. The “Fraunhofer AI Design – FRAUKE” project is establishing a new research and development center for digital chip design at the Innovation Park Artificial Intelligence (IPAI) in Heilbronn, specifically addressing the integration of AI methods and CMOS circuit design.
On the one hand, the focus is on AI-accelerated design processes that make the highly complex, previously only partially automated CMOS design more efficient, faster, and more powerful. On the other hand, the consortium is developing CMOS-based hardware for AI applications, such as in the fields of edge computing and image processing, to implement energy-efficient, highly integrated AI functions. In doing so, FRAUKE equally addresses the needs of research, industry, SMEs, and startups in CMOS-AI chip design.
Beyond the research and development content, FRAUKE pursues a holistic approach and the goal of building a sustainable ecosystem for digital chip design at the IPAI in Heilbronn and establishing an initial Fraunhofer IAF working group on this topic on-site. To this end, the Fraunhofer IAF brings in the expertise of the entire Fraunhofer Microelectronics Network—including the Research Factory for Microelectronics Germany (FMD) with its national infrastructure—and links it to the regional chip landscape of Baden-Württemberg. The University of Stuttgart and IMS CHIPS complement the network with their proven strengths in circuit design and semiconductor technology. Additionally, close collaborations are planned with stakeholders such as microTec Südwest, imec Germany, the Karlsruhe Institute of Technology (KIT), Hahn-Schickard, as well as with state initiatives such as “Chip Connect BW.”
