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From October 6 to 8, 2026, the EFX—Expo for Electronics Manufacturing will take place for the first time at the Stuttgart exhibition center. The Fraunhofer Institute for Applied Solid State Physics IAF will be exhibiting at the joint Chip Connect BW area. The focus will be on the institute’s newly launched research activities in the field of AI tools for chip design and chip design for AI applications, as well as its established expertise in III-V semiconductor manufacturing for pilot lines.
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Fraunhofer Institute for Applied Solid State Physics IAF