Electronic Circuits

Research and Development in Electronics

Fraunhofer IAF researchers develop materials, devices, modules, and sub-systems for a wide range of applications in high frequency electronics and power electronics. 

In the field of high frequency electronics, Fraunhofer IAF researchers work on metamorphic IC technology based on InGaAs mHEMTs including gate lengths of 50 nm, 35 nm, or 20 nm. This makes it possible to develop extremely low-noise and broadband applications at room temperature, but also under cryogenic conditions (e.g. for quantum computing), with cut-off frequencies of up to 1 THz.

In power electronics, we focus on GaN-based devices, circuits, and modules for highest energy efficiency and maximum voltage being used in electromobility, air conditioning, and information technology applications. Furthermore, Fraunhofer IAF researchers work on novel lateral and vertical 1200 V devices as well as monolithic and heterogeneous integration.

Focus Areas in High-Frequency Electronics and Power Electronics

Two epitaxial wafers (2'' and 4'') with vertical GaN-on-GaN process developed at Fraunhofer IAF
© Fraunhofer IAF
Epitaxial wafers (2'' and 4'') with vertical GaN-on-GaN process
D band module of Fraunhofer IAF for 6G applications
© Fraunhofer IAF
D band module for 6G applications
Golden LNA module, disassembled
© Fraunhofer IAF
Arctic Weather Satellite microwave radiometer LNA module for the 89 GHz frequency range, developed, manufactured and characterized at Fraunhofer IAF

Fraunhofer IAF realizes amplifiers suitable for space applications because they offer lowest noise figures at very high amplification.

For telecommunications, we develop transceiver ICs that enable ultra-fast data transmission up to 300 GHz and above. Also, we work with novel piezoelectric materials, such as AlScN, for high frequency filter applications.

In the millimeter wave range, Fraunhofer IAF researchers develop subsystems comprising of compact radar modules with the highest measurement accuracy for demanding applications in materials testing, automation technology, and process control.

Using GaN-on-SiC substrates, we realize microwave power amplifiers including ICs up to over 100 GHz with the following focal points:        

  • Power generation in the range 1–2 GHz with powers of 1 kW
  • Mobile amplifier in the range 0.5–6 GHz with powers up to 250 W
  • Amplifier for radio links in the Ka-band up to 40 GHz with powers in the range 5–10 W

In the E-band (71–84 GHz), various ICs with an output power of around 1 W are available. The higher frequency range at 94 GHz is being investigated for radar applications.

In the field of power electronics, Fraunhofer IAF focuses on the following aspects:

  • Maximum energy efficiency for electromobility, air conditioning and information technology
  • Novel lateral and vertical 1200 V devices
  • Monolithic and heterogeneous integration

InGaAs high-frequency electronics

InGaAs-based high-frequency components for spaceborne microwave radiometry and cryogenic measurement technology

 

GaN high-frequency electronics

GaN high-frequency components for communication, radar, test and measurement

 

GaN power electronics

GaN-based devices, power ICs, and modules for highest energy efficiency and maximum voltage

 

APECS - pan-European pilot line

Pilot Line for Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems (APECS).

Research Projects

Scientific Publications

 

Find our most recent scientific publications.

 

Information material

Learn more about current research activities and technology offers at Fraunhofer IAF.