Pilot Lines for Microelectronics and Quantum Technologies at Fraunhofer IAF

Fraunhofer IAF is extensively involved in establishing European pilot lines for microelectronics and quantum technologies, which aim to build resilient technological structures and strengthen the competitiveness of the European semiconductor industry. Fraunhofer IAF is driving the targeted expansion of its infrastructure as well as the transition of manufacturing to wafer sizes suitable for industrial use. These measures facilitate the transfer of new technologies into industrial applications.

Fraunhofer IAF offers the following in its pilot lines:

  • Novel chiplets for high-frequency applications
  • Integration of different semiconductor technologies
  • Development of ultra-thin chiplets for further performance improvement
  • Infrastructure and expertise in the field of low-temperature characterization
  • Epitaxy and characterization of diamond for quantum technologies
An employee in a lab coat is examining a wafer that has just come out of a machine
© Fraunhofer IAF
Fraunhofer IAF is actively expanding its infrastructure as part of the European pilot lines initiative.

Pilot Lines: Resilient Semiconductor Value Chains and Low-Threshold Access

Pilot lines offer large industrial companies, SMEs, and startups direct access to European and national production capacities for cutting-edge technologies. They bridge the gap between excellent research and industrial application, enabling the development, testing, and scaling of new microelectronics technologies under realistic production conditions.

Your benefits:

  • Quick access to state-of-the-art microelectronics and quantum technologies
  • No investment in your own infrastructure
  • Faster development cycles
  • Reduced technological risks

Our involvement in European pilot lines

Fraunhofer IAF contributes its expertise in microelectronics and quantum technologies to the APECS, SUPREME, SPINs, and DIREQT pilot lines, offering industry direct access to cutting-edge expertise and state-of-the-art infrastructure.

 

APECS

APECS is a pilot line for European chiplet innovations and facilitates the transfer of cutting-edge microelectronics technology into industrial applications.

Fraunhofer IAF is contributing, among other things, to the development of novel InGaAs-on-Si and GaN-on-SiC technologies as well as microbump interposers. In addition, the institute is expanding its production capacities to 6-inch wafers to facilitate the transfer to industry.

 

SUPREME

SUPREME aims to develop stable fabrication processes for superconducting quantum chips with improved reproducibility and yield.

The Fraunhofer IAF’s task is to measure the quality of qubit devices. To this end, the institute operates one of the world’s few cryogenic facilities for the statistical characterization of such devices on 150-mm to 300-mm wafers.

 

SPINS

SPINS focuses on semiconductor-based spin qubits and aims to provide quantum chips for quantum computing applications. The project’s goal is to establish an end-to-end lab-to-fab pathway that offers multi-project wafer (MPW) services using standardized quantum process design kits (PDKs).

Fraunhofer IAF contributes its infrastructure and expertise in the field of low-temperature characterization.

Further information

 

Quantum systems

Diamond-based devices and innovative solutions for quantum computing and quantum sensor technology

 

Electronic Circuits

We develop Transistors, monolithic integrated circuits (ICs) and modules for a wide range of applications.

 

Optoelectronics

We develop infrared semiconductor lasers, laser systems based on them as well as infrared and UV detectors specifically for your field of application.

 

Material development

In order to realize new device concepts and to improve and extend our current devices portfolio we investigate and develop novel materials.

Collaboration

Fraunhofer IAF - Your partner in research and development!

Find out how to work with us here.