SUPREME – Superconduction European Quantum Pilot Line

SUPREME aims to develop stable fabrication processes for superconducting quantum chips with improved reproducibility and yield. The central goal is to develop robust technologies and make them widely accessible to industry and academia. A key milestone will be the fabrication and demonstration of a 3D-integrated qubit module with 200 qubits. This will demonstrate the increased stability, higher yield, and improved reproducibility of the core fabrication processes for superconducting quantum chips. The first project phase began in early 2026, spans three and a half years, and brings together 23 partners from eight member states.

SUPREME focuses on the development and validation of key quantum processes, including angle-evaporated and etched junctions, 3D integration, and hybrid processes for applications in quantum computing, quantum sensing, and quantum communication. The goal is to achieve Technology Readiness Level (TRL) 6 and Manufacturing Readiness Level (MRL) 6.

Contribution of Fraunhofer IAF

Fraunhofer IAF’s task is to measure the quality of qubit devices. To this end, the institute operates one of the world’s few cryogenic facilities for the statistical characterization of such devices on 150-mm to 300-mm wafers. The so-called on-wafer prober enables the fully automated characterization of large quantities at measurement temperatures below 2 K (-271.15 °C). Based on this measurement data, the production of qubit devices can be systematically optimized and subsequently scaled up significantly.