Hypatia - Precise Measuring Technique through Hybrid Integration

An industry-example: Milimeter wave technology for contactless and µm-accurate measurement of diameter, ovality, wall thickness and sagging of large plastic pipes.
© Fraunhofer IAF
An industry-example: Milimeter wave technology for contactless and µm-accurate measurement of diameter, ovality, wall thickness and sagging of large plastic pipes.

Continuous wave radar systems work even in rough environments without contact but with high precision, which makes them especially interesting for industrial measuring technologies. The sensor system requirements are high in this area: They have to be build robust, economical and compact, and at the same time offer a high distance resolution. All of these requirements are only met by systems in the upper millimeter wave range. The project team of HYPATIA develops high-performance and industrial-suited packaging technologies that are meant to be used in the hybrid integration of circuits made of silicon-germanium and mHEMT circuits.

Aim of the project is the provision of a robust electrical hetero-integrated maximum frequency technology with a wide bandwidth for industrial use that is suitable for the mass market.

PROJECT TITLE

HYPATIA - Hybrid Packaging Technology for Innovative 300 GHz Radar Application

 

PROJECT DURATION

2017 − 2020

FUNDING SOURCE

Federal Ministry of Education and Research

COORDINATOR

ASINCO GmbH

GOALS

  • Development of a high-performance, industrial-suited and cost efficient packaging technology for the hybrid integration of SiGe-and mHEMT circuits.
  • Development of a broadband FMCW radar module for layer thickness measuring of dielectric materials.