With the focus on »Smart Microsystems«, the first FMD Innovation Day 2018 on 27 and 28 September 2018 will show the way towards the future of microelectronics in Germany. Topics will include: self-sufficient microsystems, environmental sensors usingLiDAR and smart sensors in the industry.

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Filming at IAF

A one-day shoot at Fraunhofer IAF captured the new machines and equipment for the Research Fab Microelectronics Germany

The largest research cooperation in the field of microelectronics in Europe shows first successes and documents these in a video. Filming also took place at Fraunhofer IAF, where the film crew looked over the researchers' shoulders as they put into operation new machines and equipment. The video will be shown during the initial operation of the first FMD integration line on September 28 at the FMD Innovation Day 2018 in Berlin. We cordially invite you to be part of the event and meet us at the accompanying fair.

The FMD label shows quite clearly: More and more research equipment purchased with the support of the Research Fab Microelectronics Germany is being put into operation at Fraunhofer IAF. This enables a step-by-step expansion of the research infrastructure in order to strengthen German micro- and nanoelectronics.

Thanks to the support of the FMD, new CMP (chemical mechanical polishing) equipment was put into operation in one of the laboratories at Fraunhofer IAF.
© Fraunhofer IAF
Thanks to the support of the FMD, new CMP (chemical mechanical polishing) equipment was put into operation in one of the laboratories at Fraunhofer IAF.
Special substrates can now be processed in the clean room of Fraunhofer IAF using a laser lithography system.
© Fraunhofer IAF
Special substrates can now be processed in the clean room of Fraunhofer IAF using a laser lithography system.

A film on the latest technological equipment at Fraunhofer IAF

The FMD Innovation Days 2018 video footage features new machines and equipment that will benefit the cooperation between the institutes of the Research Fab. Fraunhofer IAF shows the following facilities in the film:

New equipment for chemical mechanical polishing and plasma activation for wafer bonding

If different substrates are to be bonded for heterointegration, the wafers and substrates must be polished to an atomic level. Only then can they stick firmly together in a subsequent bonding process. Depending on the material (silicon, GaN, diamond, sapphire), the properties of the mechanical and chemical aids in wafer bonding must always be adapted in a new and flexible way. So far, researchers at Fraunhofer IAF worked with a system capable of handling wafer sizes up to a maximum of three inches. The new equipment which was brought to IAF thanks to the support of the FMD makes it possible to polish 100 mm wafers and also allows a much better adaptation of the roughness of the wafer surface. The matching activation system for wafer bonding has recently been placed in the clean room of the IAF. In particular, the possibility of in-situ plasma activation of substrates to realize a permanent bond without an adhesive ("wafer fusing") offers a real technological advantage.

Spray coating equipment and laser lithography for the clean room of IAF

Thanks to the support of FMD, a new laser lithography system for optical lithography processes and spray coating equipment could also be acquired for the clean room of  Fraunhofer IAF. For special substrates such as diamond, which cannot be processed automatically with a stepper due to their size, thickness or curvature, the new laser lithography is now used at Fraunhofer IAF. Among other things, it enables the heterointegration of components and their bonds at the wafer level, as it allows, for example, the processing of high topographies. To apply the photoresist for exposure, the new spray coating equipment is used. This is the only way to ensure that edges and side surfaces are completely covered. This will be of great advantage for the vertical devices of Fraunhofer IAF.

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SMART MICROSYSTEMS

FMD Innovation Day

Meet us at the FMD Innovation Day in Berlin and take a look at our radar solution to inspect packaged goods.

The event will be held in German.