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FMD Innovation Day
Meet us at the FMD Innovation Day in Berlin and take a look at our radar solution to inspect packaged goods.
The event will be held in German.
The FMD label shows quite clearly: More and more research equipment purchased with the support of the Research Fab Microelectronics Germany is being put into operation at Fraunhofer IAF. This enables a step-by-step expansion of the research infrastructure in order to strengthen German micro- and nanoelectronics.
The FMD Innovation Days 2018 video footage features new machines and equipment that will benefit the cooperation between the institutes of the Research Fab. Fraunhofer IAF shows the following facilities in the film:
If different substrates are to be bonded for heterointegration, the wafers and substrates must be polished to an atomic level. Only then can they stick firmly together in a subsequent bonding process. Depending on the material (silicon, GaN, diamond, sapphire), the properties of the mechanical and chemical aids in wafer bonding must always be adapted in a new and flexible way. So far, researchers at Fraunhofer IAF worked with a system capable of handling wafer sizes up to a maximum of three inches. The new equipment which was brought to IAF thanks to the support of the FMD makes it possible to polish 100 mm wafers and also allows a much better adaptation of the roughness of the wafer surface. The matching activation system for wafer bonding has recently been placed in the clean room of the IAF. In particular, the possibility of in-situ plasma activation of substrates to realize a permanent bond without an adhesive ("wafer fusing") offers a real technological advantage.
Thanks to the support of FMD, a new laser lithography system for optical lithography processes and spray coating equipment could also be acquired for the clean room of Fraunhofer IAF. For special substrates such as diamond, which cannot be processed automatically with a stepper due to their size, thickness or curvature, the new laser lithography is now used at Fraunhofer IAF. Among other things, it enables the heterointegration of components and their bonds at the wafer level, as it allows, for example, the processing of high topographies. To apply the photoresist for exposure, the new spray coating equipment is used. This is the only way to ensure that edges and side surfaces are completely covered. This will be of great advantage for the vertical devices of Fraunhofer IAF.
At the FMD Innovation Day on September 27 and 28 we will show you how packaged goods can be inspected in real time using our radar module. We were able to present this to the public at the Hannover Messe 2018. Get a first impression in our video and visit us during the FMD Innovation Day at the accompanying in-house exhibition.